Offering another glimpse at the expected speed of cable’s rollout of DOCSIS 3.1, chipmaker MaxLinear expects product volumes to climb toward the second half of next year.
Speaking Tuesday on the company’s third quarter earnings call, CEO Kishore Seendripu said MaxLinear made progress on its DOCSIS 3.1 initiatives during the quarter, and “we currently expect to ramp in volume in the second half of 2016.”
In September at the IBC show in Amsterdam, MaxLinear and partner Intel announced a chipset designed to be compatible with DOCSIS 3.1, the emerging multi-gigabit platform for HFC networks. That platform combines an upgraded form of Intel’s Puma silicon with MaxLinear’s MxL268 Full-Spectrum Capture tuner, which can obtain channels for bonding from anywhere along the cable spectrum. The first wave of DOCSIS 3.1 modems will be hybrids that can support both DOCSIS 3 .1 and DOCSIS 3.0-based traffic.