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CES: Broadcom Chips In For DOCSIS 3.1 - Broadcasting & Cable

CES: Broadcom Chips In For DOCSIS 3.1

Debuts D3.1- based BCM93390 reference design
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Broadcom is using this week’s International CES to unveil its first system-on-a-chip based on DOCSIS 3.1, the emerging CableLabs spec that is paving a path toward multi-gigabit speeds over HFC networks.  

Broadcom, the first chipmaker to introduce a D3.1-based chipset, unveiled the BCM93390, a modem reference design that also bakes in 802.11ac WiFi radios that, it claims, can also pump out in-home wireless speeds of up to 2 Gbps.  

Intel and STMicroelectronics, which is demonstrating DOCSIS 3.1 here at the show, are among the other chipmakers known to be developing DOCSIS 3.1 silicon.

To read the full story, visit Multichannel.com.

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